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exel
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exel2014-09-02 10:07:082014-09-02 10:07:14 "Vacuum Bonding for the Fabrication of PBSOI,” International Conference on Solid State Devices and Materials, p. 467-469, 1996
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exel2014-09-02 09:59:442014-09-02 09:59:48 "A Novel Pattern Transfer Process for Bonded SOI Giga-bit DRAMs,” Proceedings of 22nd IEEE International SOI Conference, p.114, 1996.
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exel2014-09-02 09:57:052014-09-02 09:57:08“Post CMP Cleaning for Dielectrically Isolated SOI wafers,” ECS Symposium on Chemical Mechanical Planarization, 1996
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exel2014-08-29 11:07:282014-08-29 11:07:53"Design Consideration for Patterned Wafer Bonding,” Jpn. J. Appl. Phys., 36, p.1912-1916, 1997
