https://gistexel.com/wp-content/uploads/2014/08/logo_exel.gif00exelhttps://gistexel.com/wp-content/uploads/2014/08/logo_exel.gifexel2014-09-03 14:16:582014-09-03 14:26:51 "Apparatus and methods for wafer debonding using a liquid jet,” US patent No.5783022, 1998.