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“Apparatus and methods for wafer debonding using a liquid jet,” US patent No.5783022, 1998.

2014년 9월 3일/카테고리: Patents/Book /작성자: exel
태그: B.H.Lee, G.Cha
https://gistexel.com/wp-content/uploads/2014/08/logo_exel.gif 0 0 exel https://gistexel.com/wp-content/uploads/2014/08/logo_exel.gif exel2014-09-03 14:16:582014-09-03 14:26:51 "Apparatus and methods for wafer debonding using a liquid jet,” US patent No.5783022, 1998.
다음의 항목 또한 추천합니다.
“Method for measuring capacitance”, U.S. patentNo. 6828630, 2009.06.16
“Forming gate oxide having multiple thickness,” U.S. patent No. 7,160,771, 2007.
“CMOS device on ultrathin SOI with a deposited raised source/drain, and a method of manufacture ,” US…
“Triple layer hard mask for gate patterning to fabricate scaled transistor,” US patent No.6800530, 2004
“ Integration of dual workfunction metal gate CMOS devices,” US patent No. 6653698, 2003.
"Wafer polishing device,” US patent No.5735731, 1998.

Notice

제목 작성일
[KBS 시사기획 창] 인터뷰
2019.08.23
[전자신문] 팔만대장경과 반도체
2019.08.23
[2015-05-13] 보도자료
2015.05.13
[2015-03-28] 성과를 나누는 지식활동
2015.04.27
Homepage renewal (EXEL 멤버 필독)
2015.03.26

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“Wafer polishing device,” US patent No.5735731, 1998. “ Integration of dual workfunction metal gate CMOS devices,” US patent No....
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