J.M. Leng, J.J. Sidorowich, Y.D. Yoon, J. Opsal, B. H. Lee, G. Cha, J. Moon, and S.I. Lee, "Spectrophotometry and Beam Profile Reflectometry Measurement of Six layers in a SOI Film Stack”, Proceedings of SPIE symposium on Microelectronic Manufacturing, vol. 2877, p.166, 1996
I.K. Kim, S.I. Yu, W.T. Kang, K.H. Yeom, Y.K. Kim, J.H. Lee, K.C. Park, B. H. Lee, K.W. Lee, G.Cha, S.I. Lee, T.E.Shim and J.W . Park, "Advanced Integration Technology for a Highly Scalable SOI DRAM with SOC(Silicon-On-Capacitor)”, Tech. Dig. of IEDM, p.605, (1996).
B.H. Lee, G.J. Bae, G. Cha, W.D. Kim, S.I. Lee, T. Barge, A.J. Auberton-Herve, and J.M. Lamure, "A Novel Pattern Transfer Process for Bonded SOI Giga-bit DRAMs”, Proceedings of 22nd IEEE International SOI Conference, p.114, (1996).
G. Cha, B. H. Lee, K.W. Lee, G.J. Bae, J. Moon, and S.I. Lee, "Vacuum Bonding for the Fabrication of PBSOI”, International Conference on Solid State Devices and Materials, p. 467-469, (1996).
G.J. Bae, B. H. Lee, G. Cha, S.I. Lee, “Post CMP Cleaning for Dielectrically Isolated SOI wafers”, ECS Symposium on Chemical Mechanical Planarization, (1996).
B.H. Lee, C.J. Kang, J.H. Lee, S.I. Yu, K.W. Lee, K.C. Park and T.E. Shim, "A Novel CMP Method for Cost-effective Bonded SOI Wafer fabrication,” Proceedings of 21st IEEE International SOI Conference, pp. 60-61, 1995.