구분 번호 제목
국제 6
J.M. Leng, J.J. Sidorowich, Y.D. Yoon, J. Opsal, B. H. Lee, G. Cha, J. Moon, and S.I. Lee, "Spectrophotometry and Beam Profile Reflectometry Measurement of Six layers in a SOI Film Stack”, Proceedings of SPIE symposium on Microelectronic Manufacturing, vol. 2877, p.166, 1996
국제 5

I.K. Kim, S.I. Yu, W.T. Kang, K.H. Yeom, Y.K. Kim, J.H. Lee, K.C. Park, B. H. Lee, K.W. Lee, G.Cha, S.I. Lee, T.E.Shim and J.W . Park, "Advanced Integration Technology for a Highly Scalable SOI DRAM with SOC(Silicon-On-Capacitor)”, Tech. Dig. of IEDM, p.605, (1996).

국제 4
B.H. Lee, G.J. Bae, G. Cha, W.D. Kim, S.I. Lee, T. Barge, A.J. Auberton-Herve, and J.M. Lamure, "A Novel Pattern Transfer Process for Bonded SOI Giga-bit DRAMs”, Proceedings of 22nd IEEE International SOI Conference, p.114, (1996).
국제 3
G. Cha, B. H. Lee, K.W. Lee, G.J. Bae, J. Moon, and S.I. Lee, "Vacuum Bonding for the Fabrication of PBSOI”, International Conference on Solid State Devices and Materials, p. 467-469, (1996).
국제 2
G.J. Bae, B. H. Lee, G. Cha, S.I. Lee, “Post CMP Cleaning for Dielectrically Isolated SOI wafers”, ECS Symposium on Chemical Mechanical Planarization, (1996).
국제 1
B.H. Lee, C.J. Kang, J.H. Lee, S.I. Yu, K.W. Lee, K.C. Park and T.E. Shim, "A Novel CMP Method for Cost-effective Bonded SOI Wafer fabrication,” Proceedings of 21st IEEE International SOI Conference, pp. 60-61, 1995.